๐Ÿ’ป Microchannel Two-Phase Flow Boiling

Model high-heat-flux two-phase flow boiling in microchannels: two-phase HTC (htp), confinement number (Co), boiling number (Bo), chip wall temperature, and pressure drop.

โšก Fortran 90 Engine Double Precision (IEEE 754) โœ“ ISO / ASME Validated
Microchannel Two-Phase Flow Boiling Convection
๐Ÿ“Š Solver Telemetry โ— ACTIVE
๐Ÿ‘๏ธ Views 36
โšก Solves 29
๐Ÿ’พ Downloads 387 ๐Ÿ“ฆ Fortran Code 10.8 KB
๐Ÿ“… Released Jun 2026
โฑ๏ธ Latency < 1 ms
โšก TOOLS & REPORTS:
๐Ÿ’พ Download Fortran 90
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๐Ÿ’ป Silicon Microchannel Cold Plate & Confined Vapor Slugs

Real-time visual simulation: High-heat-flux microchannel array with Taylor vapor slugs sweeping through micro-fins

๐Ÿ“ Configuration & Presets

๐Ÿ–ฅ๏ธ AI GPU Chip (R1233zd) โšก EV SiC Inverter (Water) ๐Ÿ“ก Radar GaN RF Power โ„๏ธ Micro-Evaporator Loop
๐Ÿ“ Microchannel Array Dimensions
โšก Operating Hydraulics & Heat Flux
1 W/cmยฒ = 10 kW/mยฒ
๐Ÿงช Fluid Thermophysical Properties
Kandlikar Microchannel Formulation:
โ€ข Confinement Number: Co = (1/Dh) โˆš(ฯƒ / (g (ฯL โˆ’ ฯV))) > 0.5
โ€ข Boiling Number: Bo = qโ€ณ / (G ยท hfg)
โ€ข Two-Phase HTC: htp = max( hNBD, hCBD ) [W/(mยฒยทK)]
โ€ข Wall Temperature: Twall = Tsat + (qโ€ณ / htp) [ยฐC]

๐Ÿ“Š Microchannel Boiling Results

Configure inputs and click Compute to view results.

๐Ÿ“˜ Calculation Methodology & Microchannel Boiling Standards

Kandlikar Microchannel Correlation

Incorporates confinement effects ($Co$) and boiling number ($Bo$) to capture transition between nucleate bubble nucleation and thin-film evaporation:

htp = max( hNBD, hCBD )

Confinement Number Criterion

When $Co = \frac{1}{D_h}\sqrt{\frac{\sigma}{g(\rho_L - \rho_V)}} > 0.5$, bubble growth is constrained by channel walls, forming elongated Taylor slugs.

Key Engineering Assumptions

  • Parallel rectangular microchannel heat sinks with uniform flow distribution.
  • Saturated two-phase flow boiling regimes ($0.05 \le x \le 0.85$).
  • Applicable to semiconductor electronics, high-power lasers, and compact heat exchangers.