๐ป Microchannel Two-Phase Flow Boiling
Model high-heat-flux two-phase flow boiling in microchannels: two-phase HTC (htp), confinement number (Co), boiling number (Bo), chip wall temperature, and pressure drop.
โก Fortran 90 Engine
Double Precision (IEEE 754)
โ ISO / ASME Validated
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Released
Jun 2026
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< 1 ms
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Real-time visual simulation: High-heat-flux microchannel array with Taylor vapor slugs sweeping through micro-fins๐ Configuration & Presets
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Kandlikar Microchannel Formulation:
โข Confinement Number: Co = (1/Dh) โ(ฯ / (g (ฯL โ ฯV))) > 0.5
โข Boiling Number: Bo = qโณ / (G ยท hfg)
โข Two-Phase HTC: htp = max( hNBD, hCBD ) [W/(mยฒยทK)]
โข Wall Temperature: Twall = Tsat + (qโณ / htp) [ยฐC]
โข Confinement Number: Co = (1/Dh) โ(ฯ / (g (ฯL โ ฯV))) > 0.5
โข Boiling Number: Bo = qโณ / (G ยท hfg)
โข Two-Phase HTC: htp = max( hNBD, hCBD ) [W/(mยฒยทK)]
โข Wall Temperature: Twall = Tsat + (qโณ / htp) [ยฐC]
๐ Microchannel Boiling Results
Configure inputs and click Compute to view results.
๐ Calculation Methodology & Microchannel Boiling Standards
Kandlikar Microchannel Correlation
Incorporates confinement effects ($Co$) and boiling number ($Bo$) to capture transition between nucleate bubble nucleation and thin-film evaporation:
htp = max( hNBD, hCBD )
Confinement Number Criterion
When $Co = \frac{1}{D_h}\sqrt{\frac{\sigma}{g(\rho_L - \rho_V)}} > 0.5$, bubble growth is constrained by channel walls, forming elongated Taylor slugs.
Key Engineering Assumptions
- Parallel rectangular microchannel heat sinks with uniform flow distribution.
- Saturated two-phase flow boiling regimes ($0.05 \le x \le 0.85$).
- Applicable to semiconductor electronics, high-power lasers, and compact heat exchangers.